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Describe electroplating with copper
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Electroplating with copper involves depositing a thin layer of copper onto a conductive surface. This process occurs by immersing the object in a solution containing copper ions (Cu²⁺) and passing an electric current through it. The copper ions in the solution gain electrons at the cathode (the object being plated), reducing them to copper atoms, which then adhere to the surface. This process effectively coats the object with a layer of copper.
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