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Frequently Asked Question
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If i use acids for copper dissolving and plating , than how to ensure that the process would be very slow (1 -3 weeks) , little and produces less safety risks ?
Accepted Answer
To slow down copper dissolving and plating using acids, you can implement the following strategies:
1. Use dilute acids: Lower acid concentrations will reduce the rate of reaction.
2. Decrease temperature: Chemical reactions generally proceed faster at higher temperatures. Keeping the solution cold will significantly slow down the process.
3. Use a less reactive acid: Hydrochloric acid (HCl) is generally less reactive than nitric acid (HNO3) with copper.
4. Introduce a barrier: You can use a protective layer (like a thin film of wax) on the copper surface to reduce the contact area between the acid and the metal.
5. Electrolysis with low current: Instead of direct acid attack, you can use electrolysis with a very low current. This will allow for slow and controlled copper deposition or dissolution.
Remember, even diluted acids can be hazardous. Always use appropriate safety measures, such as wearing gloves, eye protection, and working in a well-ventilated area.
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